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1 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram 2mb syncburst ? sram features ? fast clock and oe# access times ? single +3.3v +0.3v/-0.165v power supply (v dd ) ? separate +3.3v isolated output buffer supply (v dd q) ? snooze mode for reduced-power standby ? common data inputs and data outputs ? individual byte write control and global write ? three chip enables for simple depth expansion and address pipelining ? clock-controlled and registered addresses, data i/os and control signals ? internally self-timed write cycle ? burst control pin (interleaved or linear burst) ? automatic power-down ? 100-pin tqfp package ? 165-pin fbga package ? low capacitive bus loading ? x18, x32, and x36 options available options marking* ? timing (access/cycle/mhz) 3.5ns/6ns/166 mhz -6 4.0ns/7.5ns/133 mhz -7.5 5ns/10ns/100 mhz -10 ? configurations 128k x 18 MT58L128L18D 64k x 32 mt58l64l32d 64k x 36 mt58l64l36d ? packages 100-pin tqfp t 165-pin fbga f ? operating temperature range commercial (0c to +70c) none part number example: MT58L128L18Dt-10 * a part marking guide for the fbga devices can be found on microns web site http://www.micronsemi.com/support/index.html . MT58L128L18D, mt58l64l32d, mt58l64l36d 3.3v v dd , 3.3v i/o, pipelined, double-cycle deselect general description the micron ? syncburst ? sram family employs high- speed, low-power cmos designs that are fabri- cated using an advanced cmos process. microns 2mb syncburst srams integrate a 128k x 18, 64k x 32, or 64k x 36 sram core with advanced synchronous peripheral circuitry and a 2-bit burst counter. all synchronous inputs pass through registers controlled by a positive-edge-triggered single clock input (clk). the synchronous inputs include all ad- dresses, all data inputs, active low chip enable (ce#), two additional chip enables for easy depth expansion (ce2, ce2#), burst control inputs (adsc#, adsp#, adv#), byte write enables (bwx#) and global write (gw#). 100-pin tqfp* 165-pin fbga (preliminary package data) *jedec-standard ms-026 bha (lqfp).
2 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram note: functional block diagrams illustrate simplified device operation. see truth table, pin descriptions and timing diagrams for detailed information. functional block diagram 64k x 32/36 sa0, sa1, sa address register adv# clk binary counter clr q1 q0 adsp# adsc# mode sa0-sa1 16 16 14 16 bwd# bwc# bwb# bwa# bwe# gw# ce# ce2 ce2# oe# byte d write register byte c write register byte b write register byte a write register enable register pipelined enable sa0' sa1' dqs dqpa dqpb dqpb dqpb 4 output registers sense amps 64k x 8 x 4 (x32) 64k x 9 x 4 (x36) memory array output buffers e byte a write driver byte b write driver byte c write driver byte d write driver 36 36 9 9 9 9 9 9 9 9 36 36 36 input registers functional block diagram 128k x 18 sa0, sa1, sa address register adv# clk binary counter and logic clr q1 q0 adsc# 17 17 15 17 bwb# bwa# ce# 18 byte b write register byte a write register enable register 18 sa0' sa1' oe# sense amps 128k x 9 x 2 memory array adsp# 9 9 2 sa0-sa1 mode ce2 ce2# gw# bwe# pipelined enable dqs dqpa dqpb 2 18 output registers input registers 18 e 18 byte b write driver byte a write driver output buffers 9 9
3 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram general description (continued) asynchronous inputs include the output enable (oe#), clock (clk) and snooze enable (zz). there is also a burst mode pin (mode) that selects between inter- leaved and linear burst modes. the data-out (q), en- abled by oe#, is also asynchronous. write cycles can be from one to two bytes wide (x18) or from one to four bytes wide (x32/x36), as controlled by the write control inputs. burst operation can be initiated with either address status processor (adsp#) or address status controller (adsc#) input pins. subsequent burst addresses can be internally generated as controlled by the burst advance pin (adv#). address and write control are registered on-chip to simplify write cycles. this allows self-timed write cycles. individual byte enables allow individual bytes to be written. during write cycles on the x18 device, bwa# controls dqa pins and dqpa; bwb# controls dqb pins and dqpb. during write cycles on the x32 *pin 50 is reserved for address expansion. **no connect (nc) is used on the x32 version. parity (dqpx) is used on the x36 version. tqfp pin assignment table pin # x18 x32/x36 1 nc nc/ dqpc ** 2nc dqc 3nc dqc 4v dd q 5v ss 6nc dqc 7nc dqc 8 dqb dqc 9 dqb dqc 10 v ss 11 v dd q 12 dqb dqc 13 dqb dqc 14 v dd 15 v dd 16 nc 17 v ss 18 dqb dqd 19 dqb dqd 20 v dd q 21 v ss 22 dqb dqd 23 dqb dqd 24 dqpb dqd 25 nc dqd pin # x18 x32/x36 pin # x18 x32/x36 pin # x18 x32/x36 26 v ss 27 v dd q 28 nc dqd 29 nc dqd 30 nc nc/ dqpd ** 31 mode 32 sa 33 sa 34 sa 35 sa 36 sa1 37 sa0 38 dnu 39 dnu 40 v ss 41 v dd 42 dnu 43 dnu 44 sa 45 sa 46 sa 47 sa 48 sa 49 sa 50 nc/ sa * 76 v ss 77 v dd q 78 nc dqb 79 nc dqb 80 sa nc/ dqpb ** 81 sa 82 sa 83 adv# 84 adsp# 85 adsc# 86 oe# 87 bwe# 88 gw# 89 clk 90 v ss 91 v dd 92 ce2# 93 bwa# 94 bwb# 95 nc bwc# 96 nc bwd# 97 ce2 98 ce# 99 sa 100 sa 51 nc nc/ dqpa ** 52 nc dqa 53 nc dqa 54 v dd q 55 v ss 56 nc dqa 57 nc dqa 58 dqa 59 dqa 60 v ss 61 v dd q 62 dqa 63 dqa 64 zz 65 v dd 66 nc 67 v ss 68 dqa dqb 69 dqa dqb 70 v dd q 71 v ss 72 dqa dqb 73 dqa dqb 74 dqpa dqb 75 nc dqb and x36 devices, bwa# controls dqa pins and dqpa; bwb# controls dqb pins and dqpb; bwc# controls dqc pins and dqpc; bwd# controls dqd pins and dqpd. gw# low causes all bytes to be written. parity pins are only available on the x18 and x36 versions. the device incorporates an additional pipelined enable register which delays turning off the output buffer an additional cycle when a deselect is executed. this feature allows depth expansion without penaliz- ing system performance. microns 2mb syncburst srams operate from a +3.3v v dd power supply, and all inputs and outputs are ttl-compatible. the device is ideally suited for pentium ? and powerpc pipelined systems and systems that benefit from a very wide, high-speed data bus. the device is also ideal in generic 16-, 18-, 32-, 36-, 64-, and 72-bit-wide applications. please refer to microns web site ( www.micronsemi.com/datasheets/syncds.html ) for the latest data sheet.
4 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram pin assignment (top view) 100-pin tqfp sa sa adv# adsp# adsc# oe# bwe# gw# clk v ss v dd ce2# bwa# bwb# nc nc ce2 ce# sa sa 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 1 2 3 4 5 6 7 8 9 101112131415161718192021222324252627282930 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 sa nc nc v dd q v ss nc dqpa dqa dqa v ss v dd q dqa dqa v ss nc v dd zz dqa dqa v dd q v ss dqa dqa nc nc v ss v dd q nc nc nc nc/ sa * sa sa sa sa sa sa dnu dnu v dd v ss dnu dnu sa0 sa1 sa sa sa sa mode nc nc nc v dd q v ss nc nc dqb dqb v ss v dd q dqb dqb v dd v dd nc v ss dqb dqb v dd q v ss dqb dqb dqpb nc v ss v dd q nc nc nc x18 sa sa adv# adsp# adsc# oe# bwe# gw# clk v ss v dd ce2# bwa# bwb# bwc# bwd# ce2 ce# sa sa 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 nc/ dqpb ** dqb dqb v dd q v ss dqb dqb dqb dqb v ss v dd q dqb dqb v ss nc v dd zz dqa dqa v dd q v ss dqa dqa dqa dqa v ss v dd q dqa dqa nc/ dqpa ** nc/ sa * sa sa sa sa sa sa dnu dnu v dd v ss dnu dnu sa0 sa1 sa sa sa sa mode nc/ dqpc ** dqc dqc v dd q v ss dqc dqc dqc dqc v ss v dd q dqc dqc v dd v dd nc v ss dqd dqd v dd q v ss dqd dqd dqd dqd v ss v dd q dqd dqd nc/ dqpd ** x32/x36 1 2 3 4 5 6 7 8 9 101112131415161718192021222324252627282930 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 *pin 50 is reserved for address expansion. **no connect (nc) is used on the x32 version. parity (dqpx) is used on the x36 version.
5 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram tqfp pin descriptions x18 x32/x36 symbol type description 37 37 sa0 input synchronous address inputs: these inputs are registered and must 36 36 sa1 meet the setup and hold times around the rising edge of clk. 32-35, 44-49, 32-35, 44-49, sa 80-82, 99, 81, 82, 99, 100 100 93 93 bwa# input synchronous byte write enables: these active low inputs allow 94 94 bwb# individual bytes to be written and must meet the setup and hold C 95 bwc# times around the rising edge of clk. a byte write enable is low C 96 bwd# for a write cycle and high for a read cycle. for the x18 version, bwa# controls dqa pins and dqpa; bwb# controls dqb pins and dqpb. for the x32 and x36 versions, bwa# controls dqa pins and dqpa; bwb# controls dqb pins and dqpb; bwc# controls dqc pins and dqpc; bwd# controls dqd pins and dqpd. parity is only available on the x18 and x36 versions. 87 87 bwe# input byte write enable: this active low input permits byte write operations and must meet the setup and hold times around the rising edge of clk. 88 88 gw# input global write: this active low input allows a full 18-, 32-, or 36-bit write to occur independent of the bwe# and bwx# lines and must meet the setup and hold times around the rising edge of clk. 89 89 clk input clock: this signal registers the address, data, chip enable, byte write enables and burst control inputs on its rising edge. all synchronous inputs must meet setup and hold times around the clocks rising edge. 98 98 ce# input synchronous chip enable: this active low input is used to enable the device and conditions the internal use of adsp#. ce# is sampled only when a new external address is loaded. 92 92 ce2# input synchronous chip enable: this active low input is used to enable the device and is sampled only when a new external address is loaded. 64 64 zz input snooze enable: this active high, asynchronous input causes the device to enter a low-power standby mode in which all data in the memory array is retained. when zz is active, all other inputs are ignored. 97 97 ce2 input synchronous chip enable: this active high input is used to enable the device and is sampled only when a new external address is loaded. 86 86 oe# input output enable: this active low, asynchronous input enables the data i/o output drivers. 83 83 adv# input synchronous address advance: this active low input is used to advance the internal burst counter, controlling burst access after the external address is loaded. a high on this pin effectively causes wait states to be generated (no address advance). to ensure use of correct address during a write cycle, adv# must be high at the rising edge of the first clock after an adsp# cycle is initiated. (continued on next page)
6 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram tqfp pin descriptions (continued) x18 x32/x36 symbol type description 84 84 adsp# input synchronous address status processor: this active low input interrupts any ongoing burst, causing a new external address to be registered. a read is performed using the new address, independent of the byte write enables and adsc#, but dependent upon ce#, ce2, and ce2#. adsp# is ignored if ce# is high. power- down state is entered if ce2 is low or ce2# is high. 85 85 adsc# input synchronous address status controller: this active low input interrupts any ongoing burst, causing a new external address to be registered. a read or write is performed using the new address if ce# is low. adsc# is also used to place the chip into power-down state when ce# is high. 31 31 mode input mode: this input selects the burst sequence. a low on this pin selects linear burst. nc or high on this pin selects interleaved burst. do not alter input state while device is operating. (a) 58, 59, (a) 52, 53, dqa input/ sram data i/os: for the x18 version, byte a is dqa pins; byte b 62, 63, 68, 69, 56-59, 62, 63 output is dqb pins. for the x32 and x36 versions, byte a is dqa pins; 72, 73 byte b is dqb pins; byte c is dqc pins; byte d is dqd pins. (b) 8, 9, 12, (b) 68, 69, dqb input data must meet setup and hold times around the rising edge 13, 18, 19, 72-75, 78, 79 of clk. 22, 23 (c) 2, 3, 6-9, dqc 12, 13 (d) 18, 19, dqd 22-25, 28, 29 74 51 nc/ dqpa nc/ no connect/parity data i/os: on the x32 version, these pins are no 24 80 nc/ dqpb i/o connect (nc). on the x18 version, byte a parity is dqpa; byte b C1 nc/ dqpc parity is dqpb. on the x36 version, byte a parity is dqpa; byte C30 nc/ dqpd b parity is dqpb; byte c parity is dqpc; byte d parity is dqpd. 14, 15, 41, 65, 14, 15, 41, 65, v dd supply power supply: see dc electrical characteristics and operating 91 91 conditions for range. 4, 11, 20, 27, 4, 11, 20, 27, v dd q supply isolated output buffer supply: see dc electrical characteristics and 54, 61, 70, 77 54, 61, 70, 77 operating conditions for range. 5, 10, 17, 21, 5, 10, 17, 21, v ss supply ground: gnd. 26, 40, 55, 60, 26, 40, 55, 60, 67, 71, 76, 90 67, 71, 76, 90 38, 39, 42, 43 38, 39, 42, 43 dnu C do not use: these signals may either be unconnected or wired to gnd to improve package heat dissipation. 1-3, 6, 7, 16, 16, 66 nc C no connect: these signals are not internally connected and may be 25, 28-30, connected to ground to improve package heat dissipation. 51-53, 56, 57, 66, 75, 78, 79, 95, 96 50 50 nc/ sa C no connect: this pin is reserved for address expansion.
7 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram pin layout (top view) 165-pin fbga a b c d e f g h j k l m n p r a b c d e f g h j k l m n p r 2 ce# ce2 v dd q v dd q v dd q v dd q v dd q nc v dd q v dd q v dd q v dd q v dd q sa sa sa sa nc dqb dqb dqb dqb v ss nc nc nc nc nc nc nc nc nc nc nc nc nc nc v dd dqb dqb dqb dqb dqpb nc mode (lbo#) bwb# nc v ss v dd v dd v dd v dd v dd v dd v dd v dd v dd v ss sa sa nc bwa# v ss v ss v ss v ss v ss v ss v ss v ss v ss v ss nc dnu dnu ce2# clk v ss v ss v ss v ss v ss v ss v ss v ss v ss v ss nc sa1 sa0 bwe# gw# v ss v ss v ss v ss v ss v ss v ss v ss v ss v ss v ss dnu dnu adsc# oe# (g#) v ss v dd v dd v dd v dd v dd v dd v dd v dd v dd v ss sa sa adv# adsp# v dd q v dd q v dd q v dd q v dd q nc v dd q v dd q v dd q v dd q v dd q sa sa sa sa nc nc nc nc nc nc dqa dqa dqa dqa nc sa sa sa nc dqpa dqa dqa dqa dqa zz nc nc nc nc nc nc nc top view 3456789 10 11 1 a b c d e f g h j k l m n p r a b c d e f g h j k l m n p r 2 ce# ce2 v dd q v dd q v dd q v dd q v dd q nc v dd q v dd q v dd q v dd q v dd q sa sa sa sa nc dqc dqc dqc dqc v ss dqd dqd dqd dqd nc nc nc nc nc nc/ dqpc dqc dqc dqc dqc v dd dqd dqd dqd dqd nc/ dqpd nc mode (lbo#) bwc# bwd# v ss v dd v dd v dd v dd v dd v dd v dd v dd v dd v ss sa sa bwb# bwa# v ss v ss v ss v ss v ss v ss v ss v ss v ss v ss nc dnu dnu ce2# clk v ss v ss v ss v ss v ss v ss v ss v ss v ss v ss nc sa1 sa0 bwe# gw# v ss v ss v ss v ss v ss v ss v ss v ss v ss v ss v ss dnu dnu adsc# oe# (g#) v ss v dd v dd v dd v dd v dd v dd v dd v dd v dd v ss sa sa adv# adsp# v dd q v dd q v dd q v dd q v dd q nc v dd q v dd q v dd q v dd q v dd q sa sa sa sa nc dqb dqb dqb dqb nc dqa dqa dqa dqa nc sa sa nc nc nc/ dqpb dqb dqb dqb dqb zz dqa dqa dqa dqa nc/ dqpa nc nc top view 3456789 10 11 1 x18 x32/x36 *no connect (nc) is used on the x32 version. parity (dqpx) is used on the x36 version. note: pins 11r, 11p, and 6n reserved for address pin expansion; 4mb, 8mb, and 16mb respectively.
8 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram fbga pin descriptions x18 x32/x36 symbol type description 6r 6r sa0 input synchronous address inputs: these inputs are registered and must 6p 6p sa1 meet the setup and hold times around the rising edge of clk. 2a, 2b, 3p, 2a, 2b, 3p, sa 3r, 4p, 4r, 3r, 4p, 4r, 8p, 8r, 9p, 8p, 8r, 9p, 9r, 10a, 10b, 9r, 10a, 10b, 10p, 10r, 11a 10p, 10r 5b 5b bwa# input synchronous byte write enables: these active low inputs allow 4a 5a bwb# individual bytes to be written and must meet the setup and hold C 4a bwc# times around the rising edge of clk. a byte write enable is low C 4b bwd# for a write cycle and high for a read cycle. for the x18 version, bwa# controls dqas and dqpa; bwb# controls dqbs and dqpb. for the x32 and x36 versions, bwa# controls dqas and dqpa; bwb# controls dqbs and dqpb; bwc# controls dqcs and dqpc; bwd# controls dqds and dqpd. parity is only available on the x18 and x36 versions. 7a 7a bwe# input byte write enable: this active low input permits byte write operations and must meet the setup and hold times around the rising edge of clk. 7b 7b gw# input global write: this active low input allows a full 18-, 32-, or 36-bit write to occur independent of the bwe# and bwx# lines and must meet the setup and hold times around the rising edge of clk. 6b 6b clk input clock: this signal registers the address, data, chip enable, byte write enables, and burst control inputs on its rising edge. all synchronous inputs must meet setup and hold times around the clocks rising edge. 3a 3a ce# input synchronous chip enable: this active low input is used to enable the device and conditions the internal use of adsp#. ce# is sampled only when a new external address is loaded. 6a 6a ce2# i nput synchronous chip enable: this active low input is used to enable the device and is sampled only when a new external address is loaded. 11h 11h zz input snooze enable: this active high, asynchronous input causes the device to enter a low-power standby mode in which all data in the memory array is retained. when zz is active, all other inputs are ignored. 3b 3b ce2 input synchronous chip enable: this active high input is used to enable the device and is sampled only when a new external address is loaded. 8b 8b oe#(g#) i nput output enable: this active low, asynchronous input enables the data i/o output drivers. 9a 9a adv# input synchronous address advance: this active low input is used to advance the internal burst counter, controlling burst access after the external address is loaded. a high on adv# effectively causes wait states to be generated (no address advance). to ensure use of correct address during a write cycle, adv# must be high at the rising edge of the first clock after an adsp# cycle is initiated. (continued on next page)
9 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram fbga pin descriptions (continued) x18 x32/x36 symbol type description 9b 9b adsp# input synchronous address status processor: this active low input interrupts any ongoing burst, causing a new external address to be registered. a read is performed using the new address, independent of the byte write enables and adsc#, but dependent upon ce#, ce2 and ce2#. adsp# is ignored if ce# is high. power- down state is entered if ce2 is low or ce2# is high. 8a 8a adsc# input synchronous address status controller: this active low input interrupts any ongoing burst, causing a new external address to be registered. a read or write is performed using the new address if ce# is low. adsc# is also used to place the chip into power-down state when ce# is high. 1r 1r mode input mode: this input selects the burst sequence. a low on this (lb0#) input selects linear burst. nc or high on this input selects interleaved burst. do not alter input state while device is operating. (a) 10j, 10k, (a) 10j, 10k, dqa input/ sram data i/os: for the x18 version, byte a is associated dqas; 10l, 10m, 11d, 10l, 10m, 11j, output byte b is associated with dqbs. for the x32 and x36 versions, 11e, 11f, 11g 11k, 11l, 11m byte a is associated with dqas; byte b is associated with dqbs; (b) 1j, 1k, (b) 10d, 10e, dqb byte c is associated with dqcs; byte d is associated with dqds. 1l, 1m, 2d, 10f, 10g, 11d, input data must meet setup and hold times around the rising edge 2e, 2f, 2g 11e, 11f, 11g of clk. (c) 1d, 1e, dqc 1f, 1g, 2d, 2e, 2f, 2g (d) 1j, 1k, 1l, dqd 1m, 2j, 2k, 2l, 2m 11c 11n nc/ dqpa nc/ no connect/parity data i/os: on the x32 version, these are no 1n 11c nc/ dqpb i/o connect (nc). on the x18 version, byte a parity is dqpa; byte b C 1c nc/ dqpc parity is dqpb. on the x36 version, byte a parity is dqpa; byte C 1n nc/ dqpd b parity is dqpb; byte c parity is dqpc; byte d parity is dqpd. 1h, 4d, 4e, 4f, 1h, 4d, 4e, 4f, v dd supply power supply: see dc electrical characteristics and operating 4g, 4h, 4j, 4g, 4h, 4j, conditions for range. 4k, 4l, 4m, 4k, 4l, 4m, 8d, 8e, 8f, 8d, 8e, 8f, 8g, 8h, 8j, 8g, 8h, 8j, 8k, 8l, 8m 8k, 8l, 8m 3c, 3d, 3e, 3c, 3d, 3e, v dd q supply isolated output buffer supply: see dc electrical characteristics and 3f, 3g, 3j, 3f, 3g, 3j, operating conditions for range. 3k, 3l, 3m, 3k, 3l, 3m, 3n, 9c, 9d, 3n, 9c, 9d, 9e, 9f, 9g, 9e, 9f, 9g, 9j, 9k, 9l, 9j, 9k, 9l, 9m, 9n 9m, 9n (continued on next page)
10 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram fbga pin descriptions (continued) x18 x32/x36 symbol type description 2h, 4c, 4n, 5c, 2h, 4c, 4n, 5c, v ss supply ground: gnd. 5d, 5e 5f, 5d, 5e 5f, 5g, 5h, 5j, 5g, 5h, 5j, 5k, 5l, 5m, 5k, 5l, 5m, 6c, 6d, 6e, 6f, 6c, 6d, 6e, 6f, 6g, 6h, 6j, 6g, 6h, 6j, 6k, 6l, 6m, 6k, 6l, 6m, 7c, 7d, 7e, 7c, 7d, 7e, 7f, 7g, 7h, 7f, 7g, 7h, 7j, 7k, 7l, 7j, 7k, 7l, 7m, 7n, 8c, 8n 7m, 7n, 8c, 8n 5p, 5r, 7p, 7r 5p, 5r, 7p, 7r dnu C do not use: these signals may either be unconnected or wired to gnd to improve package heat dissipation. 1a, 1b, 1c, 1a, 1b, 1p, nc C no connect: these signals are not internally connected and 1d, 1e, 1f, 2c, 2n, may be connected to ground to improve package heat 1g, 1p, 2c, 2p, 2r, 3h, dissipation. pins 11r, 11p, and 6n reserved for address pin 2j, 2k, 5n, 6n, expansion; 4mb, 8mb, and 16mb respectively. 2l, 2m, 2n, 9h, 10c, 2p, 2r, 3h, 10h, 10n, 4b, 5a, 5n, 11a, 11b, 6n, 9h, 10c, 11p, 11r 10d, 10e, 10f, 10g, 10h, 10n, 11b, 11j, 11k, 11l, 11m, 11n, 11p, 11r
11 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram interleaved burst address table (mode = nc or high) first address (external) second address (internal) third address (internal) fourth address (internal) x...x00 x...x01 x...x10 x...x11 x...x01 x...x00 x...x11 x...x10 x...x10 x...x11 x...x00 x...x01 x...x11 x...x10 x...x01 x...x00 linear burst address table (mode = low) first address (external) second address (internal) third address (internal) fourth address (internal) x...x00 x...x01 x...x10 x...x11 x...x01 x...x10 x...x11 x...x00 x...x10 x...x11 x...x00 x...x01 x...x11 x...x00 x...x01 x...x10 function gw# bwe# bwa# bwb# read h h x x read h l h h write byte a h l l h write byte b h l h l write all bytes h l l l write all bytes l x x x partial truth table for write commands (x18) partial truth table for write commands (x32/x36) function gw# bwe# bwa# bwb# bwc# bwd# read h h x x x x read h l h h h h write byte a h l l h h h write all bytes h lllll write all bytes l x x x x x note: using bwe# and bwa# through bwd#, any one or more bytes may be written.
12 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram truth table operation address ce# ce2# ce2 zz adsp# adsc# adv# write# oe# clk dq used deselected cycle, power-down none h x x l x l x x x l-h high-z deselected cycle, power-down none l x l l l x x x x l-h high-z deselected cycle, power-down none l h x l l x x x x l-h high-z deselected cycle, power-down none l x l l h l x x x l-h high-z deselected cycle, power-down none l h x l h l x x x l-h high-z snooze mode, power-down none x x x h xxxxx x high-z read cycle, begin burst external l l h l l x x x l l-h q read cycle, begin burst external l l h l l x x x h l-h high-z write cycle, begin burst external l l h l h l x l x l-h d read cycle, begin burst external l l h l h l x h l l-h q read cycle, begin burst external l l h l h l x h h l-h high-z read cycle, continue burst next x x x l h h l h l l-h q read cycle, continue burst next x x x l h h l h h l-h high-z read cycle, continue burst next h x x l x h l h l l-h q read cycle, continue burst next h x x l x h l h h l-h high-z write cycle, continue burst next x x x l h h l l x l-h d write cycle, continue burst next h x x l x h l l x l-h d read cycle, suspend burst current x x x l hhhhll-hq read cycle, suspend burst current x x x l hhhhhl-h high-z read cycle, suspend burst current h x x l x h h h l l-h q read cycle, suspend burst current h x x l x h h h h l-h high-z write cycle, suspend burst current x x x l h h h l x l-h d write cycle, suspend burst current h x x l x h h l x l-h d note: 1. x means dont care. # means active low. h means logic high. l means logic low. 2. for write#, l means any one or more byte write enable signals (bwa#, bwb#, bwc# or bwd#) and bwe# are low or gw# is low. write# = h for all bwx#, bwe#, gw# high. 3. bwa# enables writes to dqa pins, dqpa. bwb# enables writes to dqb pins, dqpb. bwc# enables writes to dqc pins, dqpc. bwd# enables writes to dqd pins, dqpd. dqpa and dqpb are only available on the x18 and x36 versions. dqpc and dqpd are only available on the x36 version. 4. all inputs except oe# and zz must meet setup and hold times around the rising edge (low to high) of clk. 5. wait states are inserted by suspending burst. 6. for a write operation following a read operation, oe# must be high before the input data setup time and held high throughout the input data hold time. 7. this device contains circuitry that will ensure the outputs will be in high-z during power-up. 8. adsp# low always initiates an internal read at the l-h edge of clk. a write is performed by setting one or more byte write enable signals and bwe# low or gw# low for the subsequent l-h edge of clk. refer to write timing diagram for clarification.
13 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram absolute maximum ratings* voltage on v dd supply relative to vss .................................... -0.5v to +4.6v voltage on v dd q supply relative to vss .................................... -0.5v to +4.6v v in ............................................... -0.5v to v dd q + 0.5v storage temperature (plastic) ............ -55c to +150c junction temperature** .................................... +150c short circuit output current ........................... 100ma *stresses greater than those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect reliability. **maximum junction temperature depends upon pack- age type, cycle time, loading, ambient temperature and airflow. see micron technical note tn-05-14 for more information. 3.3v i/o dc electrical characteristics and operating conditions (0c t a +70c; v dd , v dd q = +3.3v +0.3v/-0.165v unless otherwise noted) description conditions symbol min max units notes input high (logic 1) voltage v ih 2.0 v dd + 0.3 v 1, 2 input low (logic 0) voltage v il -0.3 0.8 v 1, 2 input leakage current 0v v in v dd il i -1.0 1.0 a 3 output leakage current output(s) disabled, il o -1.0 1.0 a 0v v in v dd output high voltage i oh = -4.0ma v oh 2.4 C v 1, 4 output low voltage i ol = 8.0ma v ol C 0.4 v 1, 4 supply voltage v dd 3.135 3.6 v 1 isolated output buffer supply v dd q 3.135 v dd v 1, 5 note: 1. all voltages referenced to v ss (gnd). 2. overshoot: v ih +4.6v for t t kc/2 for i 20ma undershoot: v il 3 -0.7v for t t kc/2 for i 20ma power-up: v ih +3.6v and v dd 3.135v for t 200ms 3. mode pin has an internal pull-up, and input leakage = 10a. 4. the load used for v oh , v ol testing is shown in figure 2. ac load current is higher than the shown dc values. ac i/o curves are available upon request. 5. v dd q should never exceed v dd . v dd and v dd q can be connected together for 3.3v i/o.
14 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram i dd operating conditions and maximum limits (0c t a +70c; v dd , v dd q = +3.3v +0.3v/-0.165v unless otherwise noted) description conditions symbol typ -6 -7.5 -10 units notes power supply device selected; all inputs v il current: operating or 3 v ih ; cycle time 3 t kc min; i dd 100 340 280 225 ma 1, 2, 3 v dd = max; outputs open power supply device selected; v dd = max; current: idle adsc#, adsp#, gw#, bwx#, adv# 3 i dd 130857065ma1, 2, 3 v ih ; all inputs v ss + 0.2 or 3 v dd - 0.2; cycle time 3 t kc min cmos standby device deselected; v dd = max; all inputs v ss + 0.2 or 3 v dd - 0.2; i sb 2 0.5 10 10 10 ma 2, 3 all inputs static; clk frequency = 0 ttl standby device deselected; v dd = max; all inputs v il or 3 v ih ;i sb 3 6 25 25 25 ma 2, 3 all inputs static; clk frequency = 0 clock running device deselected; v dd = max; adsc#, adsp#, gw#, bwx#, adv# 3 i sb 4 30857065ma2, 3 v ih ; all inputs v ss + 0.2 or 3 v dd - 0.2; cycle time 3 t kc min note: 1. i dd is specified with no output current and increases with faster cycle times. i dd q increases with faster cycle times and greater output loading. 2. device deselected means device is in power-down mode as defined in the truth table. device selected means device is active (not in power-down mode). 3. typical values are measured at 3.3v, 25c, and 10ns cycle time. 4. this parameter is sampled. 5. preliminary package data. tqfp capacitance description conditions symbol typ max units notes control input capacitance t a = 25c; f = 1 mhz; c i 2.7 3.5 pf 4 input/output capacitance (dq) v dd = 3.3v c o 45pf4 address capacitance c a 2.5 3.5 pf 4 clock capacitance c ck 2.5 3.5 pf 4 max fbga capacitance description conditions symbol typ max units notes address/control input capacitance c i 2.5 3.5 p f 4, 5 output capacitance (q) t a = 25c; f = 1 mhz c o 4 5 p f 4, 5 clock capacitance c ck 2.5 3.5 p f 4, 5
15 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram tqfp thermal resistance description conditions symbol typ units notes thermal resistance test conditions follow standard test methods q ja 40 c/w 1 (junction to ambient) and procedures for measuring thermal thermal resistance impedance, per eia/jesd51. q jc 8 c/w 1 (junction to top of case) note: 1. this parameter is sampled. 2. preliminary package data. fbga thermal resistance description conditions symbol typ units notes junction to ambient test conditions follow standard test methods q ja 40 c/w 1, 2 (airflow of 1m/s) and procedures for measuring thermal junction to case (top) impedance, per eia/jesd51. q jc 9 c/w 1, 2 junction to pins q jb 17 c/w 1, 2 (bottom)
16 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram electrical characteristics and recommended ac operating conditions (note 1) (0c t a +70c; v dd = +3.3v +0.3v/-0.165v) -6 -7.5 -10 description symbol min max min max min max units notes clock clock cycle time t kc 6.0 7.5 10 ns clock frequency f kf 166 133 100 mhz clock high time t kh 1.7 1.9 3.2 ns 2 clock low time t kl 1.7 1.9 3.2 ns 2 output times clock to output valid t kq 3.5 4.0 5.0 ns clock to output invalid t kqx 1.5 1.5 1.5 ns 3 clock to output in low-z t kqlz 1.5 1.5 1.5 ns 3, 4, 5, 6 clock to output in high-z t kqhz 3.5 4.0 5.0 ns 3, 4, 5, 6 oe# to output valid t oeq 3.5 4.0 5.0 ns 7 oe# to output in low-z t oelz 0 0 0 ns 3, 4, 5, 6 oe# to output in high-z t oehz 3.5 4.0 4.5 ns 3, 4, 5, 6 setup times address t as 1.5 1.5 2.2 ns 8, 9 address status (adsc#, adsp#) t adss 1.5 1.5 2.2 ns 8, 9 address advance (adv#) t aas 1.5 1.5 2.2 ns 8, 9 write signals t ws 1.5 1.5 2.2 ns 8, 9 (bwa#-bwd#, bwe#, gw#) data-in t ds 1.5 1.5 2.2 ns 8, 9 chip enables (ce#, ce2#, ce2) t ces 1.5 1.5 2.2 ns 8, 9 hold times address t ah 0.5 0.5 0.5 ns 8, 9 address status (adsc#, adsp#) t adsh 0.5 0.5 0.5 ns 8, 9 address advance (adv#) t aah 0.5 0.5 0.5 ns 8, 9 write signals t wh 0.5 0.5 0.5 ns 8, 9 (bwa#-bwd#, bwe#, gw#) data-in t dh 0.5 0.5 0.5 ns 8, 9 chip enables (ce#, ce2#, ce2) t ceh 0.5 0.5 0.5 ns 8, 9 note: 1. test conditions as specified with the output loading shown in figure 1 (v dd q = +3.3v +0.3v/-0.165v) unless otherwise noted. 2. measured as high above v ih and low below v il . 3. this parameter is measured with the output loading shown in figure 2. 4. this parameter is sampled. 5. transition is measured 500mv from steady state voltage. 6. refer to technical note tn-58-09, synchronous sram bus contention design considerations, for a more thorough discussion on these parameters. 7. oe# is a dont care when a byte write enable is sampled low. 8. a write cycle is defined by at least one byte write enable low and adsp# high for the required setup and hold times. a read cycle is defined by all byte write enables high and adsc# or adv# low or adsp# low for the required setup and hold times. 9. this is a synchronous device. all addresses must meet the specified setup and hold times for all rising edges of clk when either adsp# or adsc# is low and chip enabled. all other synchronous inputs must meet the setup and hold times with stable logic levels for all rising edges of clock (clk) when the chip is enabled. chip enable must be valid at each rising edge of clk when either adsp# or adsc# is low to remain enabled.
17 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram q 50 v = 1.5v z = 50 o t figure 1 q 351 317 5pf +3.3v figure 2 ac test conditions input pulse levels ................. v ih = (v dd /2.2) + 1.5v .................... v il = (v dd /2.2) - 1.5v input rise and fall times ..................................... 1ns input timing reference levels ..................... v dd /2.2 output reference levels ............................ v dd q/2.2 output load ............................. see figures 1 and 2 load derating curves the micron 128k x 18, 64k x 32, and 64k x 36 syncburst sram timing is dependent upon the capaci- tive loading on the outputs. consult the factory for copies of i/o current versus voltage curves. output load equivalents
18 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram snooze mode snooze mode is a low-current, power-down mode in which the device is deselected and current is reduced to i sb 2 z . the duration of snooze mode is dictated by the length of time the zz pin is in a high state. after the device enters snooze mode, all inputs except zz become gated inputs and are ignored. the zz pin is an asynchronous, active high input that causes the device to enter snooze mode. when the zz pin becomes a logic high, i sb 2 z is guaranteed after the setup time t zz is met. any read or write operation pending when the device enters snooze mode is not guaranteed to complete successfully. therefore, snooze mode must not be initiated until valid pending operations are completed. snooze mode electrical characteristics description conditions symbol min max units notes current during snooze mode zz 3 v ih i sb 2 z 10 ma zz active to input ignored t zz 2( t kc) ns 1 zz inactive to input sampled t rzz 2( t kc) ns 1 zz active to snooze current t zzi 2( t kc) ns 1 zz inactive to exit snooze current t rzzi 0 ns 1 note: 1. this parameter is sampled. snooze mode waveform t zz i supply clk zz t rzz all inputs (except zz & pd) dont care i isb2z t zzi t rzzi outputs (q) high-z deselect or read only pd
19 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram read timing t kc t kl clk adsp# t adsh t adss address t kh oe# adsc# ce# (note 2) t ah t as a1 t ceh t ces gw#, bwe#, bwa#-bwd# q high-z t kqlz t kqx t kq adv# t oehz t kq single read burst read t oeq t oelz t kqhz burst wraps around to its initial state. t aah t aas t wh t ws t adsh t adss q(a2) q(a2 + 1) q(a2 + 2) q(a1) q(a2) q(a2 + 1) q(a3) q(a2 + 3) a2 a3 (note 1) deselect cycle. (note 3) burst continued with new base address. (note 4) adv# suspends burst. dont care undefined note: 1. q(a2) refers to output from address a2. q(a2 + 1) refers to output from the next internal burst address following a2. 2. ce2# and ce2 have timing identical to ce#. on this diagram, when ce# is low, ce2# is low and ce2 is high. when ce# is high, ce2# is high and ce2 is low. 3. timing is shown assuming that the device was not enabled before entering into this sequence. oe# does not cause q to be driven until after the following clock rising edge. 4. outputs are disabled within two clock cycles after deselect. -6 -7.5 -10 sym min max min max min max units t as 1.5 1.5 2.2 ns t adss 1.5 1.5 2.2 ns t aas 1.5 1.5 2.2 ns t ws 1.5 1.5 2.2 ns t ces 1.5 1.5 2.2 ns t ah 0.5 0.5 0.5 ns t adsh 0.5 0.5 0.5 ns t aah 0.5 0.5 0.5 ns t wh 0.5 0.5 0.5 ns t ceh 0.5 0.5 0.5 ns read timing parameters -6 -7.5 -10 sym min max min max min max units t kc 6.0 7.5 10 ns f kf 166 133 100 mhz t kh 1.7 1.9 3.2 ns t kl 1.7 1.9 3.2 ns t kq 3.5 4.0 5.0 ns t kqx 1.5 1.5 1.5 ns t kqlz 1.5 1.5 1.5 ns t kqhz 3.5 4.0 5.0 ns t oeq 3.5 4.0 5.0 ns t oelz 0 0 0 ns t oehz 3.5 4.0 4.5 ns
20 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram write timing t kc t kl clk adsp# t adsh t adss address t kh oe# adsc# ce# (note 2) t ah t as a1 t ceh t ces bwe#, bwa#-bwd# q high-z adv# burst read burst write d(a2) d(a2 + 1) d(a2 + 1) d(a3) d(a3 + 1) d(a3 + 2) d(a2 + 3) a2 a3 d extended burst write d(a2 + 2) single write t adsh t adss t adsh t adss t oehz t aah t aas t wh t ws t dh t ds (note 3) (note 1) (note 4) gw# t wh t ws (note 5) byte write signals are ignored for first cycle when adsp# initiates burst. adsc# extends burst. adv# suspends burst. dont care undefined d(a1) note: 1. d(a2) refers to input for address a2. d(a2 + 1) refers to input for the next internal burst address following a2. 2. ce2# and ce2 have timing identical to ce#. on this diagram, when ce# is low, ce2# is low and ce2 is high. when ce# is high, ce2# is high and ce2 is low. 3. oe# must be high before the input data setup and held high throughout the data hold time. this prevents input/ output data contention for the time period prior to the byte write enable inputs being sampled. 4. adv# must be high to permit a write to the loaded address. 5. full-width write can be initiated by gw# low; or gw# high and bwe#, bwa# and bwb# low for x18 device; or gw# high and bwe#, bwa#-bwd# low for x32 and x36 devices. write timing parameters -6 -7.5 -10 sym min max min max min max units t kc 6.0 7.5 10 ns f kf 166 133 100 mhz t kh 1.7 1.9 3.2 ns t kl 1.7 1.9 3.2 ns t oehz 3.5 4.0 4.5 ns t as 1.5 1.5 2.2 ns t adss 1.5 1.5 2.2 ns t aas 1.5 1.5 2.2 ns t ws 1.5 1.5 2.2 ns -6 -7.5 -10 sym min max min max min max units t ds 1.5 1.5 2.2 ns t ces 1.5 1.5 2.2 ns t ah 0.5 0.5 0.5 ns t adsh 0.5 0.5 0.5 ns t aah 0.5 0.5 0.5 ns t wh 0.5 0.5 0.5 ns t dh 0.5 0.5 0.5 ns t ceh 0.5 0.5 0.5 ns
21 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram read/write timing t kc t kl clk adsp# t adsh t adss address t kh oe# adsc# ce# (note 2) t ah t as a2 t ceh t ces q high-z adv# single write d(a3) a4 a5 a6 d(a5) d(a6) d burst read back-to-back reads high-z q(a2) q(a1) q(a4) q(a4+1) q(a4+2) t wh t ws q(a4+3) t oehz t dh t ds t oelz (note 5) t kqlz t kq back-to-back writes a1 bwe#, bwa#-bwd# (note 4) a3 dont care undefined note: 1. q(a4) refers to output from address a4. q(a4 + 1) refers to output from the next internal burst address following a4. 2. ce2# and ce2 have timing identical to ce#. on this diagram, when ce# is low, ce2# is low and ce2 is high. when ce# is high, ce2# is high and ce2 is low. 3. the data bus (q) remains in high-z following a write cycle unless an adsp#, adsc# or adv# cycle is performed. 4. gw# is high. 5. back-to-back reads may be controlled by either adsp# or adsc#. t adss 1.5 1.5 2.2 ns t ws 1.5 1.5 2.2 ns t ds 1.5 1.5 2.2 ns t ces 1.5 1.5 2.2 ns t ah 0.5 0.5 0.5 ns t adsh 0.5 0.5 0.5 ns t wh 0.5 0.5 0.5 ns t dh 0.5 0.5 0.5 ns t ceh 0.5 0.5 0.5 ns read/write timing parameters -6 -7.5 -10 sym min max min max min max units t kc 6.0 7.5 10 ns f kf 166 133 100 mhz t kh 1.7 1.9 3.2 ns t kl 1.7 1.9 3.2 ns t kq 3.5 4.0 5.0 ns t kqlz 1.5 1.5 1.5 ns t oelz 0 0 0 ns t oehz 3.5 4.0 4.5 ns t as 1.5 1.5 2.2 ns -6 -7.5 -10 sym min max min max min max units
22 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram 165-pin fbga note: 1. all dimensions in millimeters max or typical where noted. min 2. package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side. 10.00 14.00 15.00 0.10 1.00 (typ) 1.00 (typ) 5.00 0.05 13.00 0.10 pin a1 id pin a1 id ball a1 mold compound: epoxy novolac substrate: plastic laminate 6.50 0.05 7.00 0.05 7.50 0.05 1.20 max solder ball material: eutectic 63% sn, 37% pb solder ball pad: ? .33mm seating plane 0.85 0.075 0.10 a a 165x ? 0.45 ball a11
23 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram 100-pin plastic tqfp (jedec lqfp) 14.00 0.10 20.10 0.10 0.62 22.10 +0.10 -0.15 16.00 +0.20 -0.05 pin #1 id 0.65 1.50 0.10 0.25 0.60 0.15 1.40 0.05 0.32 +0.06 -0.10 0.15 +0.03 -0.02 0.10 +0.10 -0.05 detail a detail a 1.00 (typ) gage plane 0.10 note: 1. all dimensions in millimeters max or typical here noted. min 2. package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side. 8000 s. federal way, p.o. box 6, boise, id 83707-0006, tel: 208-368-3900 e-mail: prodmktg@micron.com, internet: http://www.micron.com, customer comment line: 800-932-4992 micron and syncburst are registered trademarks of micron technology, inc. pentium is a registered trademark of intel corporatio n.
24 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram micron technology, inc., reserves the right to change products or specifications without notice. MT58L128L18D_2.p65 C rev. 8/00 ?2000, micron technology, inc. 2mb: 128k x 18, 64k x 32/36 pipelined, dcd syncburst sram revision history removed fbga part marking guide, rev 8/00, final ........................................................................ august/22/00 changed fbga capacitance values, rev 8/00, final ............................................................................. au gust/7/00 c i ; typ 2.5pf from 4pf; max. 5pf from 7pf c o ; typ 4pf from 6pf; max. 5pf from 7pf c ck ; typ 2.5pf from 5pf; max. 3.5pf from 6pf removed it references, rev 7/00, final ......................................................................................... ............ july/14/00 added fbga part marking guide added revision history to datasheet removed it from part number example, rev 6/00, final ....................................................................... june /21/00 added # of datalines to the databus in x32/36 block diagram added note - preliminary package data to fbga capacitance and thermal resistance tables changed heading on mechanical drawing from bga to fbga added 165-pin fbga package, rev 3/00, final .................................................................................... ... may/23/00 added preliminary package data to diagram

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